無鹵PI補強(qiáng)
産品介紹 - 無鹵PI補強(qiáng)
Halogen free PI reinforcing plate is made of high heat resistant and high adhesive adhesive coating on PI film substrate, and the thickness is from 1mil to 10mil. The excellent properties of heat bonded to ensure its good adhesion on copper foil and PI material, widely used in various FPC reinforcement.
·産品結構及(jí)系(xì)列Product Structure and Series
産品結構 Product structure | 産品系(xì)列 Product serides |
Pi膜 PI Film 环(huán)氧樹(shù)脂 Adhesive 離型紙(zhǐ) Release Paper | 环(huán)氧胶(jiāo)系(xì)列 Epoxy series |
·産品規格 Product Specifications
Item（項目） | Test method（測試方(fāng)法(fǎ)） | Specification（規格） |
Width（幅宽(kuān)） | Specification | 250±1mm |
PI stifferner film thickness（PI厚度） | Specification | 3-9 mil |
Adhesive thickness（胶(jiāo)层(céng)厚度） | Specification | 25±3um |
Shelf life（保質(zhì)期(qī)） | 25±10℃，65±20﹪RH | 12months |
·産品性(xìng)能(néng) Product Properties
Item（項目） | Test method（測試方(fāng)法(fǎ)） | Specification（規格） | |
Adhesive flow(溢胶(jiāo)量(liàng)) | IPC TM650 2.3.17.1 | ≦0.2mm | |
Peel strength （剝離強(qiáng)度） | As Received（直(zhí)接測試） | IPC TM650 2.4.9 | ≧0.8kgf/cm |
After MEK/10min (丁酮浸泡10分(fēn)鐘(zhōng)測試) | ≧0.8kgf/cm | ||
Solder Float Resistance（耐焊性(xìng)） (after 165℃±5℃ 1hr) ( 165℃±5℃烘烤1小时(shí)後(hòu)) | IPC TM650 2.4.13 | 288℃ 10sec | |
Surface Resistivity（Ω）(表面(miàn)電(diàn)阻率) Volume Resistivity（Ω.cm）(體(tǐ)積電(diàn)阻率) | IPC TM650 2.5.17 IPC TM650 2.5.17 | ≧1.0*1013Ω | |
≧1.0*1015Ω.cm | |||
Insulation Resistance（Ω）(感(gǎn)应電(diàn)阻率) | IPC TM650 2.6.3.2 | ≧1.0*1011Ω | |
·産品应用(yòng) Product Application
用(yòng)于(yú)插拔金(jīn)手(shǒu)指等部(bù)位(wèi)補強(qiáng)。
The product is mainly used to reinforce parts such as gold finger.
